International
© Scanlab
30.06.2025

New Laser Scan Systems for Micromachining and Multi-Head Setup

At the Laser World of Photonics trade fair in Munich, Germany, visitors were able to witness the SCANcube IV 7 in action: In a multi-head setup, six synchronized scan heads demonstrated the new system's speed. They could discover the completed intelliSCAN IV product family and take a look behind the scene of various development projects and engage with product experts.  

The compact high-performance scan heads of the intelliSCAN IV product family by Scanlab have been further extended. The new intelliSCAN IV 10 scanner with 10-millimeter aperture is ideal for use in micro material processing and structuring. With the innovative SCANahead control, it achieves write speeds of around 1,310 cps in good quality. The achievable maximum speed corresponds to 360 rad/s or a remarkable 57.6 meters per second when using a lens with a focal length of f = 160 mm.  

Scan heads for Additive Manufacturing

The second new addition is the intelliSCANse IV 30 with digital encoders. The latter provide it with a significant increase in long-term stability combined with maximum precision, which makes it ideal for additive manufacturing. Thanks to the reduced dimensions, integrated water cooling and a dust and water-protected housing with IP66 protection class, they are equipped for demanding industrial use. Users can choose between classic scanner control with tracking delay and the particularly dynamic SCANahead control. Further apertures with digital encoders will follow in the next 12 months. In addition, all these scan systems are 'ready for SCANmotionControl'.  

Synchronous scanning

Another show highlight was the multi-head setup with the SCANcube IV 7, which was launched at the beginning of the year. Six scanners arranged in a row demonstrated their joint dynamic peak performance live. Reliable synchronization is achieved with RTC6 control boards. The compact scan heads are suitable for laser marking and coding thanks to their high writing speeds of up to 1,840 cps.   For the first time, Scanlab presented its various development projects with an interactive Innovations Board at the trade fair. This included a new approach for beam shaping, a concept idea for a modular welding scanner, a self-tuning approach for individual on-site adjustments as well as the new software framework for additive manufacturing. 

(Source: Scanlab)

Schlagworte

Additive ManufacturingAIAMDEDDevelopmentDINFairLaserManufacturingMaterialMaterial ProcessingPPEScannerSoftwareSystemTrackingTrade FairWelding

Verwandte Artikel

Abrasive construction affects both material removal and surface quality. More rigid products generally cut more aggressively, while flexible backings can better follow contours and produce a more refined finish.
29.09.2026

Designing Abrasive Processes for Modern Metal Fabrication

As automation, labour shortages and tighter process expectations reshape metal fabrication, grinding and finishing operations need to become more deliberate, repeatable a...

Abrasives Automation Finishing Grinding Metalwork Robotic Welding Skills Stainless Steel Steel Weld Weld Seam Welding
Read more
28.09.2026

Universal Robots Unveil New Platform for Industrial Automation

Redesigned from controller to tool flange, the new Gen 7 robot platform is out-of-the-box AI-ready, giving companies the software tools and connectivity that they need to...

AI Automation Cobot Welding Cobots Robots Welding
Read more
24.09.2026

SCHWEISSEN & SCHNEIDEN 2029 on Track for Success

Three years ahead of its next editio , SCHWEISSEN & SCHNEIDEN is clearly on course for success: more than 85 percent of the exhibition space is already allocated.

AI Automation CNC Coating Cutting Digitalisation Digitalization DVS DVS Group German Welding Society Laser Beam Welding SCHWEISSEN & SCHNEIDEN Surfacing Trade Fair Welding Young Professionals Young Welders
Read more
24.09.2026

Conference for Sustainable Materials Engineering

The 25th Materials Engineering Colloquium at Chemnitz University of Technology, Germany, takes place on March 17 and 18, 2027. Call for Papers is open until the End of Oc...

Adhesion Adhesives Bonding Brazing Hydrogen Joining Materials Engineering Research Soldering Sustainability Technical Colloquium TU Chemnitz Welding
Read more
23.09.2026

Call for Papers: International Conference on Advanced Joining Processes 2027

The 5th International Conference on Advanced Joining Processes 2027 (AJP2027) will take place in Madeira, Portugal on October 20 and 21, 2027.

Adhesion Adhesives Advanced Joining Processes Brazing Conference Energy Event Friction Stir Welding Hybrid Joining Joining Laser Beam Welding Mechanical Joining Soldering Welding
Read more